25K/Bottle BGA Solder Ball 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm Leaded Tin BGA Rework Repair Tool Reballing Reapir

25K/Bottle BGA Solder Ball 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm Leaded Tin BGA Rework Repair Tool Reballing Reapir

Features:

1.Solder (Tin) paste is the best choice of reballing IC.

2.It is used instead of the pin in the IC component package structure.

3.Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.

Brand new and high quality.

Tin ball: 0.76, 0.65,0.6, 0.55, 0.5, 0.45, 0.40, 0.35, 0.3, 0.25MM

Color:As picture

Balls Alloy: Sn63/Pb37

Standard: RoHs Available & SGS Tested

Quantity:25000pcs/bottle

Package Include:

25000pcs/bottle

Notice:

1.1cm=10mm=0.39inch.

2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.

3.Please understand that colors may exist chromatic aberration as the different placement of pictures.